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1. Specially designed for BGA chips, smartphone motherboards, and precision PCB jump wiring, ensuring clean, compact solder joints.
2. Non-insulated bare copper structure allows for direct tinning and faster soldering, eliminating stripping steps and improving repair efficiency.
3. Made from high-purity copper with excellent conductivity and low resistance, ensuring stable and secure solder joints for high-reliability electronic repairs.
4. Highly flexible and smooth wire allows easy routing through complex paths without breaking, perfect for intricate board-level repairs.
5. Versatile conductor wire suitable for various jump wire applications including mobile phones, computer motherboards, LCD screens, and audio chip repairs.
Insulation Circuit Board BGA Soldering Conductor Wire
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2. Non-insulated bare copper structure allows for direct tinning and faster soldering, eliminating stripping steps and improving repair efficiency.
3. Made from high-purity copper with excellent conductivity and low resistance, ensuring stable and secure solder joints for high-reliability electronic repairs.
4. Highly flexible and smooth wire allows easy routing through complex paths without breaking, perfect for intricate board-level repairs.
5. Versatile conductor wire suitable for various jump wire applications including mobile phones, computer motherboards, LCD screens, and audio chip repairs.
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